Tooling for wafer-level optics
Leveraging on its diamond-turning and micro-milling capabilities, Kaleido Technology offers tools for a range of replication technologies, in particular UV-embossing of polymer-on-glass lenses being used for manufacturing of wafer-level cameras for cell phones and other consumer applications.
Kaleido Technology offers tool manufacturing in the following materials: electroless nickel, brass, Copper Nickel 7030, Copper Nickel 9010, Naval brass
Thanks to proprietary compensation algorithms Kaleido Technology is able to offer micro-milled lens arrays and micro-structures with the following specifications:
| Features | |
|
Maximum tool dimension |
up to 300 mm |
|
Tool thickness |
0.7 mm - 10 mm |
|
Lens radius of curvature |
0.1 mm < r < infinity |
|
Lens profile |
Spheric, aspheric, free-form (e.g. biconic) Convex, concave, blended (i.e. goldwing) |
| Tolerances | |
|
Lens form |
< 0.2 µm (PV) |
|
Surface finish |
< 5 nm (RMS) |
|
Lens shape reproducibility error |
< 50 nm (across 200 mm wafer) |
|
Pitch error (lens-position accuracy) |
< +/- 1.5 µm (absolute across 200 mm) |